Using finite element method software to enhance teaching about copper pillar bump flip-chip packaging

Yunn Horng Guu*, Lung Sheng Lee, Ming Zheng Huang

*此作品的通信作者

研究成果: 雜誌貢獻期刊論文同行評審

1 引文 斯高帕斯(Scopus)

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Engineering & Materials Science

Social Sciences