Using finite element method software to enhance teaching about copper pillar bump flip-chip packaging

Yunn Horng Guu*, Lung Sheng Lee, Ming Zheng Huang

*此作品的通信作者

研究成果: 雜誌貢獻期刊論文同行評審

1 引文 斯高帕斯(Scopus)

摘要

This study uses Finite Element Method (FEM) software to analyse the mechanical behaviour of copper pillar bump flip-chip packaging when subjected to temperature loading. The major advantages of FEM software are that they can simulate the robustness and performance of components and assemblies, as well as enable mechanical engineering students to understand the details of the planning, design and analysis of packaging better. The proposed simulation analysis of the flip-chip packaging is suitable for the courses related to Computer-Aided Engineering (CAE) and electronic packages for junior and senior university students.

原文英語
頁(從 - 到)178-183
頁數6
期刊World Transactions on Engineering and Technology Education
9
發行號3
出版狀態已發佈 - 2011 十二月 1

ASJC Scopus subject areas

  • 教育
  • 工程 (全部)

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