Universal behavior for characteristic curve of immunomagnetic reduction assay with aid of biofunctionalized magnetic nanoparticles

Chin Yih Hong, Shieh Yueh Yang, Herng Er Horng, Jen Jie Chieh, Hong Chang Yang

研究成果: 書貢獻/報告類型會議貢獻

摘要

By biofunctionalizing magnetic nanoparticles with bioprobes, magnetic nanoparticles are able to specifically label bio-molecules. With the association between magnetic nanoparticles and bio-molecules, the mixed-frequency AC magnetic susceptibility generated with the physical rotation of individual magnetic nanoparticles under external AC magnetic fields is reduced. This detection technology is so-called immunomagnetic reduction (IMR) assay. In the experiment, several kinds of proteins and small-molecule chemicals were detected via IMR. The characteristic curves, i.e. the reduction versus the concentration of protein/chemical, for these proteins or chemicals can be scaled to one universal curve.

原文英語
主出版物標題ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009
頁面397-400
頁數4
DOIs
出版狀態已發佈 - 2009 十二月 1
事件ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009 - San Diego, CA, 美国
持續時間: 2009 八月 302009 九月 2

出版系列

名字Proceedings of the ASME Design Engineering Technical Conference
6

其他

其他ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009
國家美国
城市San Diego, CA
期間09/8/3009/9/2

ASJC Scopus subject areas

  • Modelling and Simulation
  • Mechanical Engineering
  • Computer Science Applications
  • Computer Graphics and Computer-Aided Design

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  • 引用此

    Hong, C. Y., Yang, S. Y., Horng, H. E., Chieh, J. J., & Yang, H. C. (2009). Universal behavior for characteristic curve of immunomagnetic reduction assay with aid of biofunctionalized magnetic nanoparticles. 於 ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009 (頁 397-400). (Proceedings of the ASME Design Engineering Technical Conference; 卷 6). https://doi.org/10.1115/DETC2009-86436