THERMAL WAVE IMAGING OF DEFECTS IN OPAQUE SOLIDS.

D. N. Rose*, D. C. Bryk, D. J. Thomas, R. L. Thomas, L. D. Favro, P. K. Kuo, L. J. Ingelhart, M. J. Lin, K. O. Legg

*此作品的通信作者

研究成果: 書貢獻/報告類型會議論文篇章

摘要

Thermal wave imaging of defects in opaque solids is carried out by focusing the periodically modulated intensity of a heat source (conventionally a laser, electron beam, or ion beam) at the surface of the solid. Solution of the heat equation shows that the ac temperature in the solid is wave-like (thermal waves), and critically damped. These waves can be used to probe the thermal properties of the subsurface of the solid, and their reflections from discontinuities in thermal impedance can be used to image subsurface defects such as inclusions, voids, cracks, and delaminations. Various techniques have been developed to detect the resulting ac temperature variations at the sample surface, including photoacoustic (gas-cell) detection, thermoacoustic (piezoelectric transducer) detection, optical probe beams, and ac infrared detection. Thermal wave imaging is particularly useful to probe subsurfaces from depths of about 1 micron to 300 microns, with a maximum depth of about 2 mm.

原文英語
主出版物標題Sagamore Army Materials Research Conference Proceedings
發行者Plenum Press
頁面547-564
頁數18
ISBN(列印)0306420953, 9780306420955
DOIs
出版狀態已發佈 - 1986

出版系列

名字Sagamore Army Materials Research Conference Proceedings
ISSN(列印)0080-5335

ASJC Scopus subject areas

  • 工程 (全部)

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