Thermal conductivity of thermoelectric thick films deposited by an electrodeposition process

Heng Chieh Chien*, Chii Rong Yang, Li Ling Liao, Da Jeng Yao, Chun Kai Liu, Ming Ji Dai, Ra Min Tain

*此作品的通信作者

研究成果: 書貢獻/報告類型會議論文篇章

摘要

Due to the lack of advanced technology and difficulties in sample preparing, direct measurement of thermal conductivity for thin-film thermoelectric material is rarely reported in literatures. In this work, there are four types of thermoelectric thin films measured for their intrinsic thermal conductivity by using a modified parallel-strip technique. These four types of thermoelectric thin films are of Bi-Te and Sb-Te compositions, resulting from electrodeposition process with different aqueous solutions. From the measurement results, three types of the films shown quite low intrinsic thermal conductivity less than 0.5 Wm-1K-1; and one type of the films can not be measured due to sample preparing problem. According to the scanning electron microscope observations, the grain boundaries in the thermoelectric thin films are probably the cause that results in their low thermal conductivity and the fragile structure is the cause of difficulty for the sample preparation.

原文英語
主出版物標題International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
DOIs
出版狀態已發佈 - 2010 十二月 1
事件2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference - Taipei, 臺灣
持續時間: 2010 十月 202010 十月 22

其他

其他2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference
國家/地區臺灣
城市Taipei
期間2010/10/202010/10/22

ASJC Scopus subject areas

  • 硬體和架構
  • 電氣與電子工程

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