Thermal Analysis of Eutectic Flip-Chip Light-Emitting Diodes Fabricated Using Copper-Coated Ceramic Substrate

Chien Ping Wang, Shang Ping Ying*, Yi Ching Su, Tien Li Chang

*此作品的通信作者

研究成果: 雜誌貢獻期刊論文同行評審

11 引文 斯高帕斯(Scopus)

摘要

Die attachment quality plays a remarkable role in producing highly reliable solid-state lighting fixtures by providing a dominant impact on thermal resistance. Color rendering, efficacy, and lifetime are strongly related to junction temperature. This paper investigated the effects of varying the thickness of sputter-coated copper on an Al2O3 ceramic substrate on the thermal resistance and luminous intensity of flip-chip light-emitting diode (LED) devices. Eutectic bonding was applied to provide excellent bonding strength and low void content between the chip and ceramic substrate. The thermal resistance dramatically decreased as the copper thickness was reduced because of a substantial reduction in the conduction impedance for heat dissipation from the junction to the ambient. The luminous intensity was improved by reducing the copper thickness as the driving current was increased from 50 to 700 mA. The results demonstrated that reducing the copper thickness effectively reduced the junction temperature and improved the performance of the eutectic flip-chip bonding LED devices.

原文英語
文章編號7132733
頁(從 - 到)2524-2527
頁數4
期刊IEEE Transactions on Electron Devices
62
發行號8
DOIs
出版狀態已發佈 - 2015 八月 1

ASJC Scopus subject areas

  • 電子、光磁材料
  • 電氣與電子工程

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