TY - JOUR
T1 - The growth of high-quality SiGe films with an intermediate Si layer
AU - Lee, S. W.
AU - Chen, P. S.
AU - Tsai, M. J.
AU - Chia, Chi-Ta
AU - Liu, C. W.
AU - Chen, L. J.
N1 - Funding Information:
The research was supported by the National Science Council through a grant No. NSC 91-2215-E-007-015 and the Electronics Research and Service Organization.
Copyright:
Copyright 2008 Elsevier B.V., All rights reserved.
PY - 2004/1/30
Y1 - 2004/1/30
N2 - The growth of high-quality relaxed SiGe epilayer has been achieved by introducing an intermediate Si layer in the SiGe film. It was found that intermediate Si in the SiGe film changed the mechanism of strain relaxation during the growth so that the shallow pits related to strain relief on the surface were suppressed. Such a SiGe/Si/SiGe heterostructure has a threading dislocation density of 8.9 × 105 cm-2 and a root mean square roughness of 3 nm. The intermediate Si layer was also demonstrated to act as effective nucleation site for dislocation loops to relax the mismatch strain. A mechanism of strain relaxation for this intermediate Si layer is proposed. Compared with the conventional compositionally graded buffer layer, it has the advantages of having thinner buffer layer for required degree of relaxation, smoother surface, and maintaining the threading dislocation density at the same level.
AB - The growth of high-quality relaxed SiGe epilayer has been achieved by introducing an intermediate Si layer in the SiGe film. It was found that intermediate Si in the SiGe film changed the mechanism of strain relaxation during the growth so that the shallow pits related to strain relief on the surface were suppressed. Such a SiGe/Si/SiGe heterostructure has a threading dislocation density of 8.9 × 105 cm-2 and a root mean square roughness of 3 nm. The intermediate Si layer was also demonstrated to act as effective nucleation site for dislocation loops to relax the mismatch strain. A mechanism of strain relaxation for this intermediate Si layer is proposed. Compared with the conventional compositionally graded buffer layer, it has the advantages of having thinner buffer layer for required degree of relaxation, smoother surface, and maintaining the threading dislocation density at the same level.
KW - Intermediate Si layer
KW - Root mean square roughness
KW - SiGe films
KW - Threading dislocation density
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U2 - 10.1016/S0040-6090(03)01068-X
DO - 10.1016/S0040-6090(03)01068-X
M3 - Conference article
AN - SCOPUS:1342281314
VL - 447-448
SP - 302
EP - 305
JO - Thin Solid Films
JF - Thin Solid Films
SN - 0040-6090
T2 - Proceedings of the 30th International Conference on Metallurgie
Y2 - 28 April 2002 through 2 May 2002
ER -