The Design and Assembly of Surface-Micromachined Optical Switch for Optical Add/Drop Multiplexer Application

Yu Chen Lin, Jin Chern Chiou, Wei Ting Lin, Yung Jiun Lin, Shuen De Wu

研究成果: 雜誌貢獻文章同行評審

13 引文 斯高帕斯(Scopus)

摘要

An assembly process including: flip-chip bonding, microelectromechanical (MEMS) structure release, and atomic layer deposition (ALD) is proposed to integrate a surface micromachined optical switch for optical add/drop multiplexer (OADM) applications. In the current optical switch designs, pre-stressed beams were used to pop up the micromirror and an electrode (substrate) under the beams was designed to perform ON/OFF function of the optical switch. In order to achieve desired popped-up angle for precise optical switching, a flip-chip bonding technique is applied to a mechanical stopper with an accurate joint height that can be used to constrain the movement of the micromirror. A conformal thin layer of dielectric material (AL2O 3) coated on the surfaces of device through an ALD coating process is used to improve vertical actuation force, as well as electrical isolation. Experiments indicate that the micromirrors fabricated by the present assembly process can achieve desired angle that meet the requirements of the proposed OADM configuration.

原文英語
頁(從 - 到)261-267
頁數7
期刊IEEE Transactions on Advanced Packaging
26
發行號3
DOIs
出版狀態已發佈 - 2003 八月

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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