The Demonstration of High-Quality Carbon Nanotubes as Through-Silicon Vias (TSVs) for Three-Dimensional Connection Stacking and Power-Via Technology

C. M. Yen, S. Y. Chang, K. C. Chen, Y. J. Feng, L. H. Chen, B. Z. Liao, M. H. Lee, S. C. Chen, M. H. Liao*

*此作品的通信作者

研究成果: 雜誌貢獻期刊論文同行評審

2 引文 斯高帕斯(Scopus)

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Engineering & Materials Science

Chemical Compounds