The demonstration of carbon nanotubes (CNTs) as flip-chip connections in 3-D integrated circuits with an ultralow connection resistance

M. H. Liao, P. Y. Lu, W. J. Su, S. C. Chen, H. T. Hung, C. R. Kao, W. C. Pu, C. C.A. Chen, M. H. Lee

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指紋 深入研究「The demonstration of carbon nanotubes (CNTs) as flip-chip connections in 3-D integrated circuits with an ultralow connection resistance」主題。共同形成了獨特的指紋。

Chemical Compounds

Engineering & Materials Science