The demonstration of Carbon Nano-Tubes (CNTs) as a promising high Aspect Ratio (>25) through Silicon Vias (TSVs) material for the vertical connection in the high dense 3DICs

P. Y. Lu, C. M. Yen, S. Y. Chang, Y. J. Feng, C. Lien, C. W. Hu, C. W. Yao, M. H. Lee, M. H. Liao*

*此作品的通信作者

研究成果: 書貢獻/報告類型 › 會議論文篇章

6 引文 斯高帕斯（Scopus）

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Material Science

Physics

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Engineering