Technological innovation assessment of business-to-business electronic marketplaces

Jim Wu Yen-Chun*, Hsing Piao Liu

*此作品的通信作者

研究成果: 雜誌貢獻期刊論文同行評審

7 引文 斯高帕斯(Scopus)

摘要

Business opportunities created by the Internet economy and new business methods have triggered the development of the electronic or e-marketplace, and vice versa. To generate competitive new products/services, Internet firms need to have access to detailed technological innovations to compete. Despite the wealth of literature on e-marketplaces, research on patent analyses in e-marketplaces is scarce. The patent is a crucial indicator of the technological competitiveness of a company or a nation. This study provides a preliminary step in depicting a holistic picture of technological innovations associated with e-marketplace patents. This study analyzes patents issued during the period of 1990-2002 from major databases; hence, it provides the first empirical study on e-marketplaces and related innovations holistically. A comprehensive set of statistical patent analyses and a discussion on e-marketplaces' technology by means of a patent map analysis are presented.

原文英語
頁(從 - 到)1093-1104
頁數12
期刊Journal of the American Society for Information Science and Technology
57
發行號8
DOIs
出版狀態已發佈 - 2006 6月
對外發佈

ASJC Scopus subject areas

  • 軟體
  • 資訊系統
  • 人機介面
  • 電腦網路與通信
  • 人工智慧

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