Study on ultra-fine w-EDM with on-machine measurement-assisted

Shun Tong Chen*, Hong Ye Yang

*此作品的通信作者

研究成果: 書貢獻/報告類型會議論文篇章

摘要

The purpose of this study was to develop the on-machine measurement techniques so as to precisely fabricate micro intricate part using ultra-fine w-EDM. The measurement-assisted approach which employs an automatic optical inspection (AOI) is incorporated to ultra-fine w-EDM process to on-machine detect the machining error for next re-machining. The AOI acquires the image through a high resolution CCD device from the contour of the workpiece after roughing in order to further process and recognize the image for determining the residual. This facilitates the on-machine error detection and compensation re-machining. The micro workpiece and electrode are not repositioned during machining. A fabrication for a micro probe of 30-μm diameter is rapidly machined and verified successfully. Based on the proposed technique, on-machine measurement with AOI has been realized satisfactorily.

原文英語
主出版物標題International Conference on Advances in Materials and Processing Technologies, AMPT2010
頁面1255-1260
頁數6
DOIs
出版狀態已發佈 - 2010
事件International Conference on Advances in Materials and Processing Technologies, AMPT2010 - Paris, 法国
持續時間: 2010 10月 242010 10月 27

出版系列

名字AIP Conference Proceedings
1315
ISSN(列印)0094-243X
ISSN(電子)1551-7616

其他

其他International Conference on Advances in Materials and Processing Technologies, AMPT2010
國家/地區法国
城市Paris
期間2010/10/242010/10/27

ASJC Scopus subject areas

  • 一般物理與天文學

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