Study on thinning of a boron-doped polycrystalline diamond wheel-tool by micro rotary w-EDM approach

Shun-Tong Chen, Chih Hsien Chang

研究成果: 書貢獻/報告類型會議論文篇章

4 引文 斯高帕斯(Scopus)

摘要

This study presents a novel approach for using a micro rotary wire Electrical Discharge Machining (micro w-EDM) to thin the grinding-edge of a wheel-tool made from boron-doped polycrystalline composite diamond (PCD). For thinning the PCD, two discharge circuits (a Resistance-Capacitance (RC) circuit and a transistor) were used as power sources to obtain a grinding-edge of less than 10 μm in thickness and high surface quality. The wheel-blank is vertically mounted on a spindle and while rotating is thinned by micro w-EDM along a planned computer numerically controlled path. Experimental results verify that boron-doped PCD can be successfully thinned down to 5 μm in edge-thickness. The study shows it is possible to break (cut) diamonds of 10-μm grain size, leaving smooth surface-exposed diamonds at the cutting edge of the wheel tool. The dimensional and geometrical accuracy of the wheel-tool can be exactly controlled. Raman analysis reveals graphitizing of the PCD caused by local high temperature spark erosion at a peak of 1593 cm-1 in RC discharge circuit machining. The peak at 1332 cm-1 for the transistor circuit method indicates diamond sp3 structure. The surface degenerating layer produced by transistor circuit machining gives a suitably thin grinding edge with exposed diamond grains.

原文英語
主出版物標題Advanced Materials and Process Technology
發行者Trans Tech Publications Ltd
頁面2167-2170
頁數4
ISBN(列印)9783037855027
DOIs
出版狀態已發佈 - 2012
事件2nd International Conference on Advanced Design and Manufacturing Engineering, ADME 2012 - Taiyuan, 中国
持續時間: 2012 八月 162012 八月 18

出版系列

名字Applied Mechanics and Materials
217-219
ISSN(列印)1660-9336
ISSN(電子)1662-7482

其他

其他2nd International Conference on Advanced Design and Manufacturing Engineering, ADME 2012
國家中国
城市Taiyuan
期間2012/08/162012/08/18

ASJC Scopus subject areas

  • Engineering(all)

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