TY - GEN
T1 - Study on the ESD-induced gate-oxide breakdown and the protection solution in 28nm high-k metal-gate CMOS technology
AU - Lin, Chun Yu
AU - Ker, Ming Dou
AU - Chang, Pin Hsin
AU - Wang, Wen Tai
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2016/3/22
Y1 - 2016/3/22
N2 - To protect the IC chips against the electrostatic discharge (ESD) damages in 28nm high-k metal-gate (HKMG) CMOS technology, the ESD protection consideration was studied in this work. The ESD design window was found to be within 1V and 5.1V in 28nm HKMG CMOS technology. An ESD protection device of PMOS with embedded silicon-controlled rectifier (SCR) was investigated to be suitable for ESD protection in such narrow ESD design window.
AB - To protect the IC chips against the electrostatic discharge (ESD) damages in 28nm high-k metal-gate (HKMG) CMOS technology, the ESD protection consideration was studied in this work. The ESD design window was found to be within 1V and 5.1V in 28nm HKMG CMOS technology. An ESD protection device of PMOS with embedded silicon-controlled rectifier (SCR) was investigated to be suitable for ESD protection in such narrow ESD design window.
KW - CMOS
KW - electrostatic discharge (ESD)
KW - high-k metal-gate (HKMG)
KW - silicon-controlled rectifier (SCR)
UR - http://www.scopus.com/inward/record.url?scp=84968724790&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84968724790&partnerID=8YFLogxK
U2 - 10.1109/NMDC.2015.7439250
DO - 10.1109/NMDC.2015.7439250
M3 - Conference contribution
AN - SCOPUS:84968724790
T3 - 2015 IEEE Nanotechnology Materials and Devices Conference, NMDC 2015
BT - 2015 IEEE Nanotechnology Materials and Devices Conference, NMDC 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 10th IEEE Nanotechnology Materials and Devices Conference, NMDC 2015
Y2 - 12 September 2015 through 16 September 2015
ER -