The formation of Co films on polycrystalline copper in diluted sulphuric acid was investigated by employing cyclic voltammetry (CV), atomic force microscopy, and in-situ magneto-optic Kerr effect (MOKE) techniques. By comparing CV measurements in the pure supporting electrolyte (11 mM K2SO4/1 mM H2SO4) and the cobalt sulphate solution (10 mM K2SO4/1 mM H2SO4/1 mM CoSO4), peaks from voltammetric cycling for copper dissolution, readsorption of dissolved copper ions, cobalt bulk dissolution and oxidation of hydrogen could be resolved. As the electroplating time increases, the size of the Co clusters increases and the deposition of Co corresponds to island growth. The first hysteresis loop occurs at a Co thickness of 0.33 nm in the longitudinal configuration. For films thinner than 7 nm, the Kerr intensity increases linearly because the Curie temperature of the film is well above 300 K.
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