摘要
We propose for the first time the tensile-strained Si1-xC x channel on SiGe substrate CMOS devices. Theoretical calculations show enhancement of both electron and hole mobilities in strained Si 1-xCx on SiGe substrates as compared to Si. Furthermore, the added carbon can reduce outdiffusion of boron and phosphorous, so that the source/drain junction and channel has an abrupt doping distribution, preventing short-channel effect and minimizing device dimensions. With the benefit of strain in Si1-xCx alloy being more significant than in silicon, the MOSFET structure according to the idea uses Si1-xC x instead, providing better symmetry of the designed current driving force and speed, minimizing the device scale and enhancing the current driving force.
| 原文 | 英語 |
|---|---|
| 頁面 | 363-373 |
| 頁數 | 11 |
| 出版狀態 | 已發佈 - 2004 |
| 對外發佈 | 是 |
| 事件 | SiGe: Materials, Processing, and Devices - Proceedings of the First Symposium - Honolulu, HI, 美国 持續時間: 2004 10月 3 → 2004 10月 8 |
其他
| 其他 | SiGe: Materials, Processing, and Devices - Proceedings of the First Symposium |
|---|---|
| 國家/地區 | 美国 |
| 城市 | Honolulu, HI |
| 期間 | 2004/10/03 → 2004/10/08 |
ASJC Scopus subject areas
- 一般工程
指紋
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