TY - GEN
T1 - SOP package surface discoloration after PCT test
AU - Wang, Mu Chun
AU - Yang, Hsin Chia
AU - Liu, Chuan Hsi
AU - Yang, Ren Hau
PY - 2011
Y1 - 2011
N2 - Although the new assembly technology is developed well in this recent era, the conventional surface mount package technology such as dual-side small-outline package (SOP) is still useful to the common commercial IC products. If the IC products will be delivered to the market, they must pass the reliability tests such as the pressure cook test (PCT). Unfortunately, some tested products depicted an outlook of metal migration on the surface of the packaged ICs after this product reliability test. The stressed ICs with discoloration showed a function fail.
AB - Although the new assembly technology is developed well in this recent era, the conventional surface mount package technology such as dual-side small-outline package (SOP) is still useful to the common commercial IC products. If the IC products will be delivered to the market, they must pass the reliability tests such as the pressure cook test (PCT). Unfortunately, some tested products depicted an outlook of metal migration on the surface of the packaged ICs after this product reliability test. The stressed ICs with discoloration showed a function fail.
UR - http://www.scopus.com/inward/record.url?scp=81355131853&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=81355131853&partnerID=8YFLogxK
U2 - 10.1109/ICEPT.2011.6066964
DO - 10.1109/ICEPT.2011.6066964
M3 - Conference contribution
AN - SCOPUS:81355131853
SN - 9781457717680
T3 - ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
SP - 855
EP - 858
BT - ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
T2 - 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011
Y2 - 8 August 2011 through 11 August 2011
ER -