@inproceedings{895ac73d847943e39ef0da7eb102267f,
title = "Six Sigma based approach to enhance the PCB yield",
abstract = "This paper presents a case study that a PCB company applies DMAIC-based Six Sigma methodology to improve product yield and to reduce discarding cost. According to the analysis, the inner layer open is one of the reasons that results in PCBs defect units in this case. After improving the manufacturing process, the PCBs defect units were successfully reduced from 82,100 to 69,700 defects per million, generating a cost savings of US1.41 million.",
keywords = "DMAIC, Printed circuit board, Six Sigma",
author = "Chen, \{Li Fei\} and Lin, \{Hung Chun\} and Hsu, \{Hui Po\} and Su, \{Chao Ton\}",
year = "2013",
language = "English",
isbn = "9780976348696",
series = "Proceedings - 19th ISSAT International Conference on Reliability and Quality in Design, RQD 2013",
pages = "20--23",
booktitle = "Proceedings - 19th ISSAT International Conference on Reliability and Quality in Design, RQD 2013",
note = "19th ISSAT International Conference on Reliability and Quality in Design, RQD 2013 ; Conference date: 05-08-2013 Through 07-08-2013",
}