Silicon vertical microstructure fabrication by catalytic etching

Mao Jung Huang, Chii Rong Yang, Chun Ming Chang, Nien Nan Chu, Ming Hua Shiao

研究成果: 雜誌貢獻文章同行評審

8 引文 斯高帕斯(Scopus)

摘要

This study presents an effective, simple and inexpensive process for forming micro-scale vertical structures on a (100) silicon wafer. Several modified etchants and micro-patterns including rectangular, snake-like, circular and comb patterns were employed to determine the optimum etching process. We found that an etchant solution consisting of 4.6M hydrofluoric acid, 0.44M hydrogen peroxide and isopropyl alcohol produces microstructures at an etching rate of 0.47m min 1and surface roughness of 17.4nm. All the patterns were transferred faithfully to the silicon substrate.

原文英語
文章編號085002
期刊Journal of Micromechanics and Microengineering
22
發行號8
DOIs
出版狀態已發佈 - 2012 八月 1

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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