Settling studies of underfill particles for flip-chip solder interconnections

Chiang Ho Cheng, An Shik Yang, Chih Jer Lin, Chun-Ta Chen

研究成果: 書貢獻/報告類型會議貢獻

1 引文 斯高帕斯(Scopus)

摘要

In view of the flip-chip on board packaging method, an underfill encapsulant material is dispensed along one or two adjacent sides of the chip. The capillary force then draws the underfill beneath the chip to fill the gap between the integrated circuit (IC) chip and substrate. These shear stresses are imposed on the solder interconnections owing to a significant mismatch of coefficient of thermal expansion (CTE) between the IC chip and substrate. Hence, this underfill is required to specifically harmonize the CTE value of the solder for minimization of the stresses caused by the thermal inconsistency between the IC chip and substrate. This paper aims to conduct the micromechanical analysis using the Eshelby equivalence inclusions principle and Mori-Tankaka's average stress field concept for investigating the equivalence thermolelastic of underfill filler particles. In calculations, the finite element method (FEM) software ANSYS is used to simulate the inhomogeneity of underfill fillers, such as settling of filler particles, for appraising the reliability of flip chip solder interconnections. We further probed if the reliability of flip chip solder interconnections could be influenced by the predicted volume fractions of underfill fillers.

原文英語
主出版物標題Proceedings of the World Congress on Engineering 2013, WCE 2013
頁面2109-2114
頁數6
出版狀態已發佈 - 2013 十一月 25
事件2013 World Congress on Engineering, WCE 2013 - London, 英国
持續時間: 2013 七月 32013 七月 5

出版系列

名字Lecture Notes in Engineering and Computer Science
3 LNECS
ISSN(列印)2078-0958

其他

其他2013 World Congress on Engineering, WCE 2013
國家英国
城市London
期間13/7/313/7/5

ASJC Scopus subject areas

  • Computer Science (miscellaneous)

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  • 引用此

    Cheng, C. H., Yang, A. S., Lin, C. J., & Chen, C-T. (2013). Settling studies of underfill particles for flip-chip solder interconnections. 於 Proceedings of the World Congress on Engineering 2013, WCE 2013 (頁 2109-2114). (Lecture Notes in Engineering and Computer Science; 卷 3 LNECS).