Room-temperature carbon nanotube circuit soldering by thionin-based dip-pen nanolithography

Chung Wei Chien, Wan Yu Tang, Chong Mou Wang

研究成果: 雜誌貢獻文章

摘要

Inspired by the fact that thionin (TN) is an effective mediator of extracellular electron-transfer reactions, we assessed the potential of TN as a solder paste for carbon nanotube (CNT) circuits. When TN (10 mM in water) was delivered by conductive-mode atomic force microscopic (AFM) tips to conductive indium-doped tin oxide (ITO) glass slides via dip-pen nanolithography (DPN), the ink formed cylinder-shaped nanodots on the sites after a bias voltage (Vtip) ranging from −3 to −8 V at a relative humidity (RH) level > 50% was applied to the tips. If the tip bias polarity was reversed or the RH lowered to < 50% or |Vtip| to < 3 V, no dots appeared. An AFM tip field-induced local oxidation (ALO) and a water meniscus located between the tip and the deposited ink droplets featured prominently in the formation of these nanostructures. The ink could also be hardened on CNTs under similar conditions. As applied to CNTs that had been positioned on ITO electrodes, the solder could bind the tubes to the electrodes and substantially lower the CNT|ITO junction resistance. The TN-based DPN was shown to be a potential room-temperature nanospot welding technique for the assembly of CNT circuits.

原文英語
頁(從 - 到)M125-M129
期刊ECS Journal of Solid State Science and Technology
6
發行號10
DOIs
出版狀態已發佈 - 2017 一月 1

指紋

Thionins
Nanolithography
Carbon Nanotubes
Soldering
Tin oxides
Ink
Indium
Carbon nanotubes
Soldering alloys
Networks (circuits)
Atmospheric humidity
Electron tubes
Electrodes
Bias voltage
Temperature
Water
Nanostructures
Welding
Ointments
Glass

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

引用此文

Room-temperature carbon nanotube circuit soldering by thionin-based dip-pen nanolithography. / Chien, Chung Wei; Tang, Wan Yu; Wang, Chong Mou.

於: ECS Journal of Solid State Science and Technology, 卷 6, 編號 10, 01.01.2017, p. M125-M129.

研究成果: 雜誌貢獻文章

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