摘要
The instantaneous switch-off of the gas precursors during the ramp-down cycle in a spike ramp process is demonstrated to be an effective method to enhance the reliability of rapid thermal oxide. Due to the slow ramp-down rate (60°C-90°C/s) of a rapid thermal process, the oxidation during the slow ramp-down cycle may produce the inferior oxide, especially for ultrathin oxide. To avoid the oxidation in the slow ramp-down cycle, the oxidation precursor (oxygen) is switched off during the ramp-down cycle. The reliability of resulting oxide without oxidation during the ramp-down cycle is enhanced as compared with the conventional oxide, which is still oxidized during the ramp-down cycle.
| 原文 | 英語 |
|---|---|
| 頁(從 - 到) | 656-659 |
| 頁數 | 4 |
| 期刊 | IEEE Transactions on Semiconductor Manufacturing |
| 卷 | 16 |
| 發行號 | 4 |
| DOIs | |
| 出版狀態 | 已發佈 - 2003 11月 |
| 對外發佈 | 是 |
ASJC Scopus subject areas
- 電子、光磁材料
- 凝聚態物理學
- 工業與製造工程
- 電氣與電子工程
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