Reliability characteristics of metal-oxide-semiconductor capacitors with 0.72 nm equivalent-oxide-thickness LaO/HfO2 stacked gate dielectrics

Chuan-Hsi Liu*, Hung Wen Hsu, Hung Wen Chen, Pi Chun Juan, Mu Chun Wang, Chin-Pao Cheng, Heng Sheng Huang

*此作品的通信作者

研究成果: 雜誌貢獻期刊論文同行評審

4 引文 斯高帕斯(Scopus)

摘要

La-incorporated HfO2 could improve the thermal stability and interface trap quality. Laminated structures with different doping positions and thicknesses were fabricated by RF magnetron co-sputtering method. The physical and electrical properties of HfO2/HfLaO/p-Si and HfLaO/HfO 2/p-Si structures after 850 °C postannealing were analyzed. And the time dependent dielectric breakdown (TDDB) characteristics were also analyzed for metal-oxide-semiconductor (MOS) capacitors with atomic-layer-deposited (ALD) HfLaO gate dielectrics. For TDDB characteristics, the Weibull slopes were independent of stress voltages and capacitor areas, but they were dependent on the stress temperatures. The electric-field acceleration parameter (γ) is about 4.3-4.5 MV/cm. The maximum voltage (Vg) for 10-year TDDB lifetime under 85 °C operation is Vg = 2.03 V, or equivalently 6.1 MV/cm.

原文英語
頁(從 - 到)15-18
頁數4
期刊Microelectronic Engineering
89
發行號1
DOIs
出版狀態已發佈 - 2012 一月 1

ASJC Scopus subject areas

  • 電子、光磁材料
  • 原子與分子物理與光學
  • 凝聚態物理學
  • 表面、塗料和薄膜
  • 電氣與電子工程

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