Realization of ultrafast and high-quality anodic bonding using a non-contact scanning electrode

Jim Wei Wu, Chii Rong Yang*, Mao Jung Huang, Cheng Hao Yang, Che Yi Huang

*此作品的通信作者

研究成果: 雜誌貢獻期刊論文同行評審

5 引文 斯高帕斯(Scopus)

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Engineering

Material Science

Physics

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