摘要
This study presents a combined self-assembled nano-sphere lithography (SANL) and catalytic etching technique to cost-effectively form an arrayed nano-column on a silicon wafer. The highest aspect ratio of the column fabricated through catalytic etching in this study was approximately 41:1. The electroforming method can convert a silicon nano-column array to a nano-pore array in a metallic stamp. Finally, a hot embossing process was used to mold nano-column arrays on polymethyl methacrylate (PMMA) substrate. The resulting structured PMMA surface exhibited a contact angle of 99.8°.
| 原文 | 英語 |
|---|---|
| 頁(從 - 到) | 2576-2579 |
| 頁數 | 4 |
| 期刊 | Microelectronic Engineering |
| 卷 | 88 |
| 發行號 | 8 |
| DOIs | |
| 出版狀態 | 已發佈 - 2011 8月 |
ASJC Scopus subject areas
- 電子、光磁材料
- 原子與分子物理與光學
- 凝聚態物理學
- 表面、塗料和薄膜
- 電氣與電子工程
指紋
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