TY - GEN
T1 - Performance of silver-glue attachment technology in assembly
AU - Wang, Mu Chun
AU - Huang, Kuo Shu
AU - Hsieh, Zhen Ying
AU - Yang, Hsin Chia
AU - Liu, Chuan Hsi
AU - Lin, Chii Ruey
PY - 2010
Y1 - 2010
N2 - Before the wire bonding or flip-chip package is executed, the die-attachment process must be implemented first. In this study, we observe that the quality, sticking process, epoxyresin diffusion and thickness of silver paste agglutinating the die and the lead-frame critically determine the final package performance.
AB - Before the wire bonding or flip-chip package is executed, the die-attachment process must be implemented first. In this study, we observe that the quality, sticking process, epoxyresin diffusion and thickness of silver paste agglutinating the die and the lead-frame critically determine the final package performance.
UR - https://www.scopus.com/pages/publications/78449302443
UR - https://www.scopus.com/pages/publications/78449302443#tab=citedBy
U2 - 10.1109/ICEPT.2010.5583797
DO - 10.1109/ICEPT.2010.5583797
M3 - Conference contribution
AN - SCOPUS:78449302443
SN - 9781424481422
T3 - Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
SP - 472
EP - 475
BT - Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
T2 - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
Y2 - 16 August 2010 through 19 August 2010
ER -