Performance of silver-glue attachment technology in assembly

Mu Chun Wang*, Kuo Shu Huang, Zhen Ying Hsieh, Hsin Chia Yang, Chuan Hsi Liu, Chii Ruey Lin

*此作品的通信作者

研究成果: 書貢獻/報告類型會議論文篇章

摘要

Before the wire bonding or flip-chip package is executed, the die-attachment process must be implemented first. In this study, we observe that the quality, sticking process, epoxyresin diffusion and thickness of silver paste agglutinating the die and the lead-frame critically determine the final package performance.

原文英語
主出版物標題Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
頁面472-475
頁數4
DOIs
出版狀態已發佈 - 2010
事件2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 - Xi'an, 中国
持續時間: 2010 八月 162010 八月 19

出版系列

名字Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

其他

其他2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
國家/地區中国
城市Xi'an
期間2010/08/162010/08/19

ASJC Scopus subject areas

  • 電氣與電子工程

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