Performance of silver-glue attachment technology in assembly

Mu Chun Wang, Kuo Shu Huang, Zhen Ying Hsieh, Hsin Chia Yang, Chuan Hsi Liu, Chii Ruey Lin

研究成果: 書貢獻/報告類型會議貢獻

摘要

Before the wire bonding or flip-chip package is executed, the die-attachment process must be implemented first. In this study, we observe that the quality, sticking process, epoxyresin diffusion and thickness of silver paste agglutinating the die and the lead-frame critically determine the final package performance.

原文英語
主出版物標題Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
頁面472-475
頁數4
DOIs
出版狀態已發佈 - 2010 十一月 24
事件2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 - Xi'an, 中国
持續時間: 2010 八月 162010 八月 19

出版系列

名字Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

其他

其他2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
國家中国
城市Xi'an
期間10/8/1610/8/19

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • 引用此

    Wang, M. C., Huang, K. S., Hsieh, Z. Y., Yang, H. C., Liu, C. H., & Lin, C. R. (2010). Performance of silver-glue attachment technology in assembly. 於 Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 (頁 472-475). [5583797] (Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010). https://doi.org/10.1109/ICEPT.2010.5583797