Performance evaluation of a hybrid cooling system for electronic chips

Lung Yue Jeng, Tun-Ping Teng*

*此作品的通信作者

研究成果: 雜誌貢獻期刊論文同行評審

22 引文 斯高帕斯(Scopus)

摘要

This study develops a hybrid cooling system that combines the advantages of a liquid cooling system and a vapor compression refrigeration system (VCRS). This hybrid cooling system uses Al2O3/water nanofluid and hydrocarbon refrigerant as the working liquid and VCRS cooling for the CPU. A heating module was used to simulate the heat of the CPU at different power levels. The surface temperature of the heating module and pumping power consumption under various experimental parameters were measured to assess the performance and feasibility of the hybrid cooling system. Experimental results show that the maximum cooling capacities of the liquid, VCRS, and hybrid cooling systems are 450W, 270W, and 540W, respectively. Using Al2O3/water nanofluid instead of distilled water in liquid cooling system leads to greater heat dissipation performance, greater power consumption for the water pump, and a lower surface temperature on the heater. In addition to cooling electronic chips, the hybrid cooling system can be used in other heat dissipation applications involving high-heat components to increase system performance and extend the lifetime of the apparatus or equipment.

原文英語
頁(從 - 到)155-162
頁數8
期刊Experimental Thermal and Fluid Science
45
DOIs
出版狀態已發佈 - 2013 二月

ASJC Scopus subject areas

  • 化學工程 (全部)
  • 核能與工程
  • 航空工程
  • 機械工業
  • 流體流動和轉移過程

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