Parametric Optimization of WEDM Process for Machining ANSI Steel Using Soft-Computing Methods

Yi Zhen Chen*, Hsin Han Chiang, Jo An Liao, Yen Lin Chen, Hsiao Chi Li

*此作品的通信作者

研究成果: 書貢獻/報告類型會議論文篇章

摘要

This paper introduces a parametric method for optimizing the wire electric discharge machining (WEDM) process applied to steel machining. The proposed approach employs soft-computing methods to determine the optimal process parameters for achieving maximum material removal rate and minimum surface roughness. This work conducts an analytical investigation to evaluate the feasibility of the proposed approach.

原文英語
主出版物標題2023 International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2023 - Proceedings
發行者Institute of Electrical and Electronics Engineers Inc.
頁面861-862
頁數2
ISBN(電子)9798350324174
DOIs
出版狀態已發佈 - 2023
對外發佈
事件2023 International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2023 - Pingtung, 臺灣
持續時間: 2023 7月 172023 7月 19

出版系列

名字2023 International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2023 - Proceedings

會議

會議2023 International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2023
國家/地區臺灣
城市Pingtung
期間2023/07/172023/07/19

ASJC Scopus subject areas

  • 人工智慧
  • 人機介面
  • 資訊系統
  • 資訊系統與管理
  • 電氣與電子工程
  • 媒體技術
  • 儀器

指紋

深入研究「Parametric Optimization of WEDM Process for Machining ANSI Steel Using Soft-Computing Methods」主題。共同形成了獨特的指紋。

引用此