Optimization of step-edge substrates for high-TC superconducting devices

C. H. Wu, M. J. Chen, M. H. Hsu, J. C. Chen, K. L. Chen, J. H. Chen, J. T. Jeng, T. S. Lai, H. E. Horng, H. C. Yang*

*此作品的通信作者

研究成果: 雜誌貢獻期刊論文同行評審

7 引文 斯高帕斯(Scopus)

摘要

To pursue step-edge for high-TC superconducting grain boundary junctions or SQUIDs with high reproducibility and quality, we have developed two-step procedures of fabricating very good step-edge substrates. A protocol of precisely controlling step angles for Josephson junctions has been established, with which we can predict the step angles as well as get a better control of the fabrication process. The procedures can improve the step ramp quality substantially. There are no needles, waves, trenches, cascade, or other flaws on these surfaces. The step substrates present good uniformity with respect to any step angle. We have characterized high-TC step-edge dc SQUIDs connected in series. The I-V curves of SQUID arrays show the RSJ behavior. The enhanced modulation amplitude of 110 μV is achieved at 77 K with the step-edge dc SQUID in series. The results clearly show the high uniformity and quality of the fabricated step-edge Josephson junctions.

原文英語
頁(從 - 到)108-114
頁數7
期刊Physica C: Superconductivity and its applications
433
發行號1-2
DOIs
出版狀態已發佈 - 2005 12月 1

ASJC Scopus subject areas

  • 電子、光磁材料
  • 凝聚態物理學
  • 能源工程與電力技術
  • 電氣與電子工程

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