Novel positive-tone thick photoresist for high aspect ratio microsystem technology

G. W. Hsieh, Y. S. Hsieh, C. R. Yang, Y. D. Lee*

*此作品的通信作者

研究成果: 雜誌貢獻期刊論文同行評審

5 引文 斯高帕斯(Scopus)

摘要

A methacrylate copolymer combining chemically amplified concept and casting technique was developed as a novel thick photoresist for the UV-LIGA process. Photoresist layers up to 500 μm in thickness can be fabricated easily. Microstructures fabricated by the novel thick photoresist were demonstrated. At present, the ring-shape microstructures with 150 μm tall and 15 μm wide have been realized and the calculated aspect ratio is 10.

原文英語
頁(從 - 到)326-329
頁數4
期刊Microsystem Technologies
8
發行號4-5
DOIs
出版狀態已發佈 - 2002 八月

ASJC Scopus subject areas

  • 電子、光磁材料
  • 凝聚態物理學
  • 硬體和架構
  • 電氣與電子工程

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