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Noncontact electrical test of a ball grid array substrate that uses the electro-optic probing technique

  • Wen Kai Kuo*
  • , Deng Tzung Tang
  • , Chien Jang Wu
  • , Thomson Lai
  • *此作品的通信作者

研究成果: 雜誌貢獻期刊論文同行評審

2   連結會在新分頁中打開 引文 斯高帕斯(Scopus)

摘要

A new technique for testing a ball grid array (BGA) package substrate that uses the electro-optic (EO) probing technique is investigated. This technique can detect open circuits in the BGA substrate with a high spatial resolution. An experimental setup that uses an EO probe tip made of LiNbO3 crystal is reported along with the measurement results from a real BGA substrate.

原文英語
頁(從 - 到)4205-4210
頁數6
期刊Applied Optics
44
發行號20
DOIs
出版狀態已發佈 - 2005 7月 10
對外發佈

ASJC Scopus subject areas

  • 原子與分子物理與光學
  • 工程(雜項)
  • 電氣與電子工程

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