摘要
A new technique for testing a ball grid array (BGA) package substrate that uses the electro-optic (EO) probing technique is investigated. This technique can detect open circuits in the BGA substrate with a high spatial resolution. An experimental setup that uses an EO probe tip made of LiNbO3 crystal is reported along with the measurement results from a real BGA substrate.
| 原文 | 英語 |
|---|---|
| 頁(從 - 到) | 4205-4210 |
| 頁數 | 6 |
| 期刊 | Applied Optics |
| 卷 | 44 |
| 發行號 | 20 |
| DOIs | |
| 出版狀態 | 已發佈 - 2005 7月 10 |
| 對外發佈 | 是 |
ASJC Scopus subject areas
- 原子與分子物理與光學
- 工程(雜項)
- 電氣與電子工程
指紋
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