Noncontact electrical test of a ball grid array substrate that uses the electro-optic probing technique

Wen Kai Kuo*, Deng Tzung Tang, Chien Jang Wu, Thomson Lai

*此作品的通信作者

研究成果: 雜誌貢獻期刊論文同行評審

2 引文 斯高帕斯(Scopus)

摘要

A new technique for testing a ball grid array (BGA) package substrate that uses the electro-optic (EO) probing technique is investigated. This technique can detect open circuits in the BGA substrate with a high spatial resolution. An experimental setup that uses an EO probe tip made of LiNbO3 crystal is reported along with the measurement results from a real BGA substrate.

原文英語
頁(從 - 到)4205-4210
頁數6
期刊Applied Optics
44
發行號20
DOIs
出版狀態已發佈 - 2005 7月 10
對外發佈

ASJC Scopus subject areas

  • 原子與分子物理與光學
  • 工程(雜項)
  • 電氣與電子工程

指紋

深入研究「Noncontact electrical test of a ball grid array substrate that uses the electro-optic probing technique」主題。共同形成了獨特的指紋。

引用此