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Negative-Capacitance FinFET Inverter, Ring Oscillator, SRAM Cell, and Ft

  • Kai Shin Li
  • , Yun Jie Wei
  • , Yi Ju Chen
  • , Wen Cheng Chiu
  • , Hsiu Chih Chen
  • , Min Hung Lee
  • , Yu Fan Chiu
  • , Fu Kuo Hsueh
  • , Bo Wei Wu
  • , Pin Guang Chen
  • , Tung Yan Lai
  • , Chun Chi Chen
  • , Jia Min Shieh
  • , Wen Kuan Yeh
  • , Sayeef Salahuddin
  • , Chenming Hu

研究成果: 書貢獻/報告類型 › 會議論文篇章

32   連結會在新分頁中打開 引文 斯高帕斯(Scopus)

摘要

In this work, we use thermal-ALD to prepare ferroelectric HfZrO2 (HZO) thin film with thickness from 3 to 7 nm for the NC-FinFET's gate stack. The subthreshold swing (SS) was as low as 5 mV/dec (SSmin) over 4 orders of ID. Lower thermal budget process, CO2 far-infrared laser activation and 400°C Ni silicide are employed in the 2-level metal backend integration for maintaining the orthorhombic phase in HZO thin film and minimizing the hysteresis in IV. NC-FinFET inverter has 77% higher voltage gain compared to FinFET-inverter employing HfO2 gate dielectric. NC-FinFET ring oscillator exhibit small speed and power advantages over FinFET oscillator. For the first time, NC-FET cut-off frequency (Ft) frequency is measured, 23.1 GHz or 23% higher than the control FET Ft. NC-FinFET SRAM was observed to exhibit large noise margin.

原文英語
主出版物標題2018 IEEE International Electron Devices Meeting, IEDM 2018
發行者Institute of Electrical and Electronics Engineers Inc.
頁面31.7.1-31.7.4
ISBN(電子)9781728119878
DOIs
出版狀態已發佈 - 2018 7月 2
事件64th Annual IEEE International Electron Devices Meeting, IEDM 2018 - San Francisco, 美国
持續時間: 2018 12月 1 → 2018 12月 5

出版系列

名字Technical Digest - International Electron Devices Meeting, IEDM
卷2018-December
ISSN(列印)0163-1918

會議

會議64th Annual IEEE International Electron Devices Meeting, IEDM 2018
國家/地區美国
城市San Francisco
期間2018/12/01 → 2018/12/05

ASJC Scopus subject areas

  • 電子、光磁材料
  • 凝聚態物理學
  • 電氣與電子工程
  • 材料化學

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