Multi-Layer Chips on Wafer Stacking Technologies with Carbon Nano-Tubes as Through-Silicon Vias and it's potential applications for Power-Via technologies

  • Bo Zhou Liao
  • , Liang Hsi Chen
  • , Kai Cheng Chen
  • , Hong Yi Lin
  • , Yi Ting Tsai
  • , Ting Wei Chen
  • , Yi Cheng Chan
  • , Min Hung Lee
  • , Ming Han Liao*
    • *此作品的通信作者

研究成果: 書貢獻/報告類型 › 會議論文篇章

5 引文 斯高帕斯（Scopus）

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