Multi-Layer Chips on Wafer Stacking Technologies with Carbon Nano-Tubes as Through-Silicon Vias and it's potential applications for Power-Via technologies

Bo Zhou Liao, Liang Hsi Chen, Kai Cheng Chen, Hong Yi Lin, Yi Ting Tsai, Ting Wei Chen, Yi Cheng Chan, Min Hung Lee, Ming Han Liao*

*此作品的通信作者

研究成果: 書貢獻/報告類型 › 會議論文篇章

3 引文 斯高帕斯（Scopus）

指紋

深入研究「Multi-Layer Chips on Wafer Stacking Technologies with Carbon Nano-Tubes as Through-Silicon Vias and it's potential applications for Power-Via technologies」主題。共同形成了獨特的指紋。

INIS

Earth and Planetary Sciences

Engineering

Physics