Multi-Layer Chips on Wafer Stacking Technologies with Carbon Nano-Tubes as Through-Silicon Vias and it's potential applications for Power-Via technologies

Bo Zhou Liao, Liang Hsi Chen, Kai Cheng Chen, Hong Yi Lin, Yi Ting Tsai, Ting Wei Chen, Yi Cheng Chan, Min Hung Lee, Ming Han Liao*

*此作品的通信作者

研究成果: 書貢獻/報告類型會議論文篇章

摘要

In this work, carbon nanotubes (CNTs) are grown as advanced filler materials in through-silicon via (TSV). Electrical and thermal properties of CNTs are extracted by experiments and the implementation of multi-layer stacking is proposed. The resistance and thermal conductivity of CNT are measured as 10.5 ohm and 49 W/mK respectively. In accordance with its superior properties over copper, Carbon nanotubes as TSVs (CNT-TSV) have several advantages in three-dimensional integrated circuit (3DIC) technology. Signal integrity index, namely return loss and insertion loss have been evaluated by ANSYS HFSS (High frequency Structure Simulator). Within the high frequency interval (10~20 GHz), CNT-TSV has better electrical characteristics than copper. In summary, CNTs can be a promising material used in future chip on wafer stacking process.

原文英語
主出版物標題Proceedings - IEEE 72nd Electronic Components and Technology Conference, ECTC 2022
發行者Institute of Electrical and Electronics Engineers Inc.
頁面1811-1817
頁數7
ISBN(電子)9781665479431
DOIs
出版狀態已發佈 - 2022
事件72nd IEEE Electronic Components and Technology Conference, ECTC 2022 - San Diego, 美国
持續時間: 2022 5月 312022 6月 3

出版系列

名字Proceedings - Electronic Components and Technology Conference
2022-May
ISSN(列印)0569-5503

會議

會議72nd IEEE Electronic Components and Technology Conference, ECTC 2022
國家/地區美国
城市San Diego
期間2022/05/312022/06/03

ASJC Scopus subject areas

  • 電子、光磁材料
  • 電氣與電子工程

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