Modeling to predict positive pressurization required to control mold growth from infiltration in buildings in a hot and humid climate

Wei Jen Chen*, David E. Claridge, Chae Rohrs, Jiajun Liao

*此作品的通信作者

研究成果: 雜誌貢獻期刊論文同行評審

6 引文 斯高帕斯(Scopus)

摘要

Commercial buildings in humid regions of the United State are generally designed to operate at a positive pressure to limit mold growth, material deterioration and other condensation related problems from infiltration in hot and humid climates. This paper combines existing models of infiltration and mold growth to predict the influence of pressurization level on the risk of mold growth. Walls are treated differently depending on their height and the direction they face. Local weather data are utilized to generate the outside pressure field. Temperature measurements performed on an actual building are applied to a multi-layer envelope temperature prediction model, used to simulate the performance of three different envelope constructions. Annual change in mold index is calculated for three humid locations for one construction type and for two other construction types in one location. The simulated results indicate that for a 22 °C indoor temperature set-point, 3 m high walls facing all directions in an unpressurized building in College Station, TX, will experience an annual increase in mold index. However, 1.5 Pa positive pressurization results in a negative annual change in mold index for all walls that should theoretically eliminate the long-term risk of an increasing mold index on all walls. The model also indicates that only 1 Pa pressurization is required to produce negative annual change in mold index if the same building is moved to Fort Worth, TX and no pressurization is required in Atlanta, GA with a 22 °C indoor temperature set-point.

原文英語
頁(從 - 到)102-113
頁數12
期刊Building and Environment
104
DOIs
出版狀態已發佈 - 2016 8月 1
對外發佈

ASJC Scopus subject areas

  • 環境工程
  • 土木與結構工程
  • 地理、規劃與發展
  • 建築與營造

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