摘要
The future trends of compound semiconductor and silicon-based millimeter-wave monolithic microwave integrated circuits (MMICs) and millimeter-wave system on chip (SOC), are discussed. The use of millimeter-wave MMICs has been increased for commercial applications including communications and automotive radar. The system in package (SIP) technology involves optimal combinations of the components for the best performance in a system. The SIP also requires that the circuit of the system can be implemented in different technologies and integrated into a single package. SOC technology involves that all radio-frequency front-end, analog, mixed-signal, and digital circuits need to be integrated on a single chip. GaAs and InP MMICs can be used to achieve excellent noise or power performance in the transceiver. Researchers are making efforts to develop millimeter wave SOC with base-band circuitry including digital, analog, or mixed-mode circuits.
原文 | 英語 |
---|---|
頁面 | 99-117 |
頁數 | 19 |
卷 | 10 |
無 | 1 |
專業出版物 | IEEE Microwave Magazine |
DOIs | |
出版狀態 | 已發佈 - 2009 2月 |
對外發佈 | 是 |
ASJC Scopus subject areas
- 輻射
- 凝聚態物理學
- 電氣與電子工程