摘要
We demonstrate a low threshold voltage (Vt) of -0.17 V and good hole mobility (54 cm2/V · s at 0.8 MV/cm) in TaN/ Ir/LaTiO p-MOSFETs at an equivalent oxide thickness of only 0.66 nm. This was achieved by using Ni-induced solid-phase diffusion of SiO2-covered Ni/Ga which reduced the high-κ dielectric interfacial reactions. This approach, along with its self-aligned and gate-first process, is compatible with current VLSI technology.
| 原文 | 英語 |
|---|---|
| 頁(從 - 到) | 681-863 |
| 頁數 | 183 |
| 期刊 | IEEE Electron Device Letters |
| 卷 | 30 |
| 發行號 | 6 |
| DOIs | |
| 出版狀態 | 已發佈 - 2009 |
| 對外發佈 | 是 |
ASJC Scopus subject areas
- 電子、光磁材料
- 電氣與電子工程
指紋
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