Implementation of Bi-2223 HTS tapes as RF coils for 3T MRI system

In Tsang Lin, Chang Wei Hsieh, Li Wei Kuo, Hong Chang Yang, Herng Er Horng, Wei Hao Chang, Jyh Horng Chen

研究成果: 書貢獻/報告類型會議貢獻

摘要

One way to reduce receiving coil noise in MRI scans is using non-resistive high-temperature superconducting (HTS) coils. They show advantages of much lower cost and easier fabrication over HTS thin film coils. In this work, we built a 200mm in diameter Bb2Sr2Ca2Cu3O x (Bi-2223) tape HTS RF coil and demonstrated that the SNR of using the HTS tape coil was 2.22 folds higher than that of the traditional copper coil for a phantom MR study. Test results were in agreement with predictions, and the error of predicted SNR gains and measured SNR gains is about 0.9%. In vivo imaging, we also demonstrated that the SNR of using the HTS tape coil was 1.95 folds higher than that of the traditional copper coil for a human wrist MR study. The HTS coil can be expected to generate higher SNR gain after optimization. Further applications functional MRI is under investigation to test the power of this HTSC system in our 3T system.

原文英語
主出版物標題TENCON 2005 - 2005 IEEE Region 10 Conference
發行者Institute of Electrical and Electronics Engineers Inc.
ISBN(列印)0780393112, 9780780393110
DOIs
出版狀態已發佈 - 2005 一月 1
事件TENCON 2005 - 2005 IEEE Region 10 Conference - Melbourne, 澳大利亚
持續時間: 2005 十一月 212005 十一月 24

出版系列

名字IEEE Region 10 Annual International Conference, Proceedings/TENCON
2007
ISSN(列印)2159-3442
ISSN(電子)2159-3450

其他

其他TENCON 2005 - 2005 IEEE Region 10 Conference
國家澳大利亚
城市Melbourne
期間05/11/2105/11/24

    指紋

ASJC Scopus subject areas

  • Computer Science Applications
  • Electrical and Electronic Engineering

引用此

Lin, I. T., Hsieh, C. W., Kuo, L. W., Yang, H. C., Horng, H. E., Chang, W. H., & Chen, J. H. (2005). Implementation of Bi-2223 HTS tapes as RF coils for 3T MRI system. 於 TENCON 2005 - 2005 IEEE Region 10 Conference [4085108] (IEEE Region 10 Annual International Conference, Proceedings/TENCON; 卷 2007). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TENCON.2005.301308