Identifying professional competencies of the flip-chip packaging engineer in Taiwan

Y. H. Guu*, Kuen Yi Lin, Lung-Sheng Lee


研究成果: 雜誌貢獻期刊論文同行評審

1 引文 斯高帕斯(Scopus)


This study employed a literature review, expert interviews, and a questionnaire survey to construct a set of twotier competencies for a flip-chip packaging engineer. The fuzzy Delphi questionnaire was sent to 12 flip-chip engineering experts to identify professional competencies that a flip-chip packaging engineer must have. Four competencies, including flip-chip technology, bumping process, stress analysis, and reliability testing, and their subordinate 15 competency indicators were developed. The results serve as a reference for designing or assessing curricula or programs for preparing a quality flip-chip packaging engineer and to be used as a guideline to recruit and select a flip-chip packaging engineer.

頁(從 - 到)61-70
期刊Turkish Online Journal of Educational Technology
出版狀態已發佈 - 2014 十月 1

ASJC Scopus subject areas

  • 教育


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