This study employed a literature review, expert interviews, and a questionnaire survey to construct a set of twotier competencies for a flip-chip packaging engineer. The fuzzy Delphi questionnaire was sent to 12 flip-chip engineering experts to identify professional competencies that a flip-chip packaging engineer must have. Four competencies, including flip-chip technology, bumping process, stress analysis, and reliability testing, and their subordinate 15 competency indicators were developed. The results serve as a reference for designing or assessing curricula or programs for preparing a quality flip-chip packaging engineer and to be used as a guideline to recruit and select a flip-chip packaging engineer.
|頁（從 - 到）||61-70|
|期刊||Turkish Online Journal of Educational Technology|
|出版狀態||已發佈 - 2014 十月 1|
ASJC Scopus subject areas