@inproceedings{c0fbd704c5fd410091fb9fbc61c4cb11,
title = "Green energy computing of heterojunction with intrinsic thin layer (HIT) solar cell by CAD (Computer aided design)",
abstract = "The strain distribution and electrical characteristics of heterojunction with intrinsic thin layer (HIT) solar cells with mechanical bending are studied in this work. The degradation due to the strain can be indeed suppressed with wafer absorber thinning down under mechanical bending and leads Voc, Jsc, F.F. and η exhibiting excellent mechanical reliability. The advantage of wafer thinning down for HIT is not only decreasing electron-hole recombination, but also improving the mechanical reliability of solar cells.",
keywords = "HIT, absorber, bandgap, mechanical stress",
author = "Lee, {M. H.} and Liao, {M. H.} and Tai, {C. W.} and Chang, {S. T.}",
note = "Funding Information: This work is supported by the Ministry of Science and Technology, Taiwan, under contract nos. MOST 105-2628-E-003-002-MY3 and 105-2622-8-002-003, and the computing supported by National Center for High-Performance Computing (NCHC), Taiwan Publisher Copyright: {\textcopyright} 2016 IEEE.; 2016 Future Technologies Conference, FTC 2016 ; Conference date: 06-12-2016 Through 07-12-2016",
year = "2017",
month = jan,
day = "17",
doi = "10.1109/FTC.2016.7821775",
language = "English",
series = "FTC 2016 - Proceedings of Future Technologies Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "13298--13301",
booktitle = "FTC 2016 - Proceedings of Future Technologies Conference",
}