Functional electroless gold Ohmic contacts in light emitting diodes

P. Y. Chen; H. C. Wong; S. F. Hu; C. Y. Huang; R. S. Liu

doi:10.1063/1.3624831

Functional electroless gold Ohmic contacts in light emitting diodes

P. Y. Chen, H. C. Wong, S. F. Hu^*, C. Y. Huang, R. S. Liu

^*此作品的通信作者

物理學系

研究成果: 雜誌貢獻 › 期刊論文 › 同行評審

2 引文斯高帕斯（Scopus）

摘要

Conducting gold pads on light-emitting diodes chips are synthesized by electroless chemical deposition and exhibit no color difference, reliable ability of wire bonding, and high electrical conductivity. A plating electrolyte with a long life time and high stability is developed. The hardness of pads formed by electroless plating is three times softer than those formed by evaporation and the force gauge of the p- and n-pads yields of approximately 55 g. The mechanism of electroless gold plating is elucidated and the functions of chemical reagents are explained using the proposed model. The industrial application of electroless gold plating is feasible.

原文	英語
文章編號	063511
期刊	Applied Physics Letters
卷	99
發行號	6
DOIs	https://doi.org/10.1063/1.3624831
出版狀態	已發佈 - 2011 8月 8

ASJC Scopus subject areas

物理與天文學（雜項）

存取文件

10.1063/1.3624831

其它文件與鏈接

引用此

@article{f5ee5493a7ae4964a0fbef3645d9b8b7,

title = "Functional electroless gold Ohmic contacts in light emitting diodes",

abstract = "Conducting gold pads on light-emitting diodes chips are synthesized by electroless chemical deposition and exhibit no color difference, reliable ability of wire bonding, and high electrical conductivity. A plating electrolyte with a long life time and high stability is developed. The hardness of pads formed by electroless plating is three times softer than those formed by evaporation and the force gauge of the p- and n-pads yields of approximately 55 g. The mechanism of electroless gold plating is elucidated and the functions of chemical reagents are explained using the proposed model. The industrial application of electroless gold plating is feasible.",

author = "Chen, {P. Y.} and Wong, {H. C.} and Hu, {S. F.} and Huang, {C. Y.} and Liu, {R. S.}",

note = "Funding Information: The authors would like to thank Epistar Corp. and the National Science Council of the Republic of China, Taiwan (Contracts Nos. NSC 99-2112-M-003-007-MY3 and NSC 99-2113-M-002-012-MY3) for financially supporting this research. ",

year = "2011",

month = aug,

day = "8",

doi = "10.1063/1.3624831",

language = "English",

volume = "99",

journal = "Applied Physics Letters",

issn = "0003-6951",

publisher = "American Institute of Physics Publising LLC",

number = "6",

}

TY - JOUR

T1 - Functional electroless gold Ohmic contacts in light emitting diodes

AU - Chen, P. Y.

AU - Wong, H. C.

AU - Hu, S. F.

AU - Huang, C. Y.

AU - Liu, R. S.

N1 - Funding Information: The authors would like to thank Epistar Corp. and the National Science Council of the Republic of China, Taiwan (Contracts Nos. NSC 99-2112-M-003-007-MY3 and NSC 99-2113-M-002-012-MY3) for financially supporting this research.

PY - 2011/8/8

Y1 - 2011/8/8

N2 - Conducting gold pads on light-emitting diodes chips are synthesized by electroless chemical deposition and exhibit no color difference, reliable ability of wire bonding, and high electrical conductivity. A plating electrolyte with a long life time and high stability is developed. The hardness of pads formed by electroless plating is three times softer than those formed by evaporation and the force gauge of the p- and n-pads yields of approximately 55 g. The mechanism of electroless gold plating is elucidated and the functions of chemical reagents are explained using the proposed model. The industrial application of electroless gold plating is feasible.

AB - Conducting gold pads on light-emitting diodes chips are synthesized by electroless chemical deposition and exhibit no color difference, reliable ability of wire bonding, and high electrical conductivity. A plating electrolyte with a long life time and high stability is developed. The hardness of pads formed by electroless plating is three times softer than those formed by evaporation and the force gauge of the p- and n-pads yields of approximately 55 g. The mechanism of electroless gold plating is elucidated and the functions of chemical reagents are explained using the proposed model. The industrial application of electroless gold plating is feasible.

UR - http://www.scopus.com/inward/record.url?scp=84860422145&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84860422145&partnerID=8YFLogxK

U2 - 10.1063/1.3624831

DO - 10.1063/1.3624831

M3 - Article

AN - SCOPUS:84860422145

SN - 0003-6951

VL - 99

JO - Applied Physics Letters

JF - Applied Physics Letters

IS - 6

M1 - 063511

ER -

Functional electroless gold Ohmic contacts in light emitting diodes

摘要

ASJC Scopus subject areas

存取文件

其它文件與鏈接

指紋

引用此