Functional electroless gold Ohmic contacts in light emitting diodes

P. Y. Chen, H. C. Wong, S. F. Hu*, C. Y. Huang, R. S. Liu

*此作品的通信作者

研究成果: 雜誌貢獻期刊論文同行評審

2 引文 斯高帕斯(Scopus)

摘要

Conducting gold pads on light-emitting diodes chips are synthesized by electroless chemical deposition and exhibit no color difference, reliable ability of wire bonding, and high electrical conductivity. A plating electrolyte with a long life time and high stability is developed. The hardness of pads formed by electroless plating is three times softer than those formed by evaporation and the force gauge of the p- and n-pads yields of approximately 55 g. The mechanism of electroless gold plating is elucidated and the functions of chemical reagents are explained using the proposed model. The industrial application of electroless gold plating is feasible.

原文英語
文章編號063511
期刊Applied Physics Letters
99
發行號6
DOIs
出版狀態已發佈 - 2011 八月 8

ASJC Scopus subject areas

  • 物理與天文學(雜項)

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