Flip-chip-assembled W-band CMOS chip modules on ceramic integrated passive device with transition compensation for millimeter-wave system-in-package integration

Hsin Chia Lu*, Che Chung Kuo, Po An Lin, Chen Fang Tai, Yi Long Chang, Yu Sian Jiang, Jeng Han Tsai, Yue Ming Hsin, Huei Wang

*此作品的通信作者

研究成果: 雜誌貢獻 › 期刊論文 › 同行評審

46 引文 斯高帕斯（Scopus）

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INIS

Computer Science