跳至主導覽 跳至搜尋 跳過主要內容

Fabrication of large-area, high-density Ni nanopillar arrays on GaAs substrates using diblock copolymer lithography and electrodeposition

  • Chun Chieh Chang*
  • , Dan Botez
  • , Lei Wan
  • , Paul F. Nealey
  • , Steven Ruder
  • , Thomas F. Kuech
  • *此作品的通信作者

研究成果: 雜誌貢獻期刊論文同行評審

6   連結會在新分頁中打開 引文 斯高帕斯(Scopus)

摘要

Large-area, ultradense Ni nanopillar arrays were fabricated directly on bare n-GaAs substrates using diblock copolymer lithography and electrodeposition. The Ni nanopillar arrays are hexagonally arranged, exhibiting an average pillar diameter of ∼24 nm, and an areal density of ∼10 11/cm2 over an entire surface area of 1 cm × 1 cm. These arrays represent large-scale, highly dense, sub-30 nm metal-nanopillar arrays made on III-V semiconductor substrates suitable as pattern masks. The fabrication method offers a simple and effective route to manufacturing large-area, highly dense, sub-30 nm metal nanostructures for III-V optoelectronic devices, in order to enhance their performance and functionalities.

原文英語
文章編號031801
期刊Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics
31
發行號3
DOIs
出版狀態已發佈 - 2013 5月
對外發佈

ASJC Scopus subject areas

  • 電子、光磁材料
  • 儀器
  • 製程化學與技術
  • 表面、塗料和薄膜
  • 電氣與電子工程
  • 材料化學

指紋

深入研究「Fabrication of large-area, high-density Ni nanopillar arrays on GaAs substrates using diblock copolymer lithography and electrodeposition」主題。共同形成了獨特的指紋。

引用此