摘要
A gate dielectric process was developed by remote plasma nitridation of N2O oxides with rapid thermal NO annealing. Superior interface properties, reduced leakage current and improved reliability was shown by the films. The stress induced leakage current (SILC) was shown as a function of stress time under constant voltage stress of 2.6 V in inversion mode and stress temperature of 160°C.
| 原文 | 英語 |
|---|---|
| 頁(從 - 到) | 268-271 |
| 頁數 | 4 |
| 期刊 | Annual Proceedings - Reliability Physics (Symposium) |
| 出版狀態 | 已發佈 - 2002 |
| 對外發佈 | 是 |
| 事件 | Proceedings of the 2002 40th annual IEEE International Relaibility Physics Symposium Proceedings - Dallas, TX, 美国 持續時間: 2002 4月 7 → 2002 4月 11 |
ASJC Scopus subject areas
- 電氣與電子工程
- 安全、風險、可靠性和品質
指紋
深入研究「Extending the reliability scaling limit of gate dielectrics through remote plasma nitridation of N2O-grown oxides and NO RTA treatment」主題。共同形成了獨特的指紋。引用此
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