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Electrical and reliability characteristics in strained-Si mOSFETs

  • Chia Cheng Yang*
  • , Tung Ming Pan
  • , Kai Ming Chen
  • , Chuan Hsi Liu
  • *此作品的通信作者

研究成果: 書貢獻/報告類型會議論文篇章

摘要

In this study, surface-channel MOSFETs processed on strained-Si on relaxed Si1-xGex virtual substrates feature significantly enhanced carrier mobility (64% for electrons and 45% for holes) than that of the bulk-Si control devices. The drain current of the strained-Si nMOSFET increases by 45% compared to 4.5% in strained-Si pMOSFET. The strained-Si pMOSFETs surface roughness scattering begins to dominate at a relatively low effective field (∼0.2 MV/cm) that accordingly limits the drive current enhancement of strained-Si pMOSFETs. Furthermore, experimental data indicates that hot carrier and negative bias temperature instability are a potential reliability concern for strained-Si nMOSFETs and pMOSFETs, respectively.

原文英語
主出版物標題ECS Transactions - Dielectrics for Nanosystems 3
主出版物子標題Materials Science, Processing, Reliability, and Manufacturing
頁面271-277
頁數7
版本2
DOIs
出版狀態已發佈 - 2008
對外發佈
事件3rd International Symposium on Dielectrics for Nanosystems: Materials Science, Processing, Reliability and Manufacturing - 213th ECS Meeting - Phoenix, AZ, 美国
持續時間: 2008 5月 182008 5月 22

出版系列

名字ECS Transactions
號碼2
13
ISSN(列印)1938-5862
ISSN(電子)1938-6737

其他

其他3rd International Symposium on Dielectrics for Nanosystems: Materials Science, Processing, Reliability and Manufacturing - 213th ECS Meeting
國家/地區美国
城市Phoenix, AZ
期間2008/05/182008/05/22

ASJC Scopus subject areas

  • 一般工程

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